Nanovea Introduces New Yield Strength Measuring Technique

While we require many advanced hardware items in our day to day lives, most are not aware as to why we use these items for those particular applications. To give you a rough idea, any mechanical item is used because it guarantees a particular operating strength. However for any advanced metal/ tool we used, the yield strength measuring instrument is the same old one, but not any further. Nanovea, an organization with over 20 years of experience in mechanical testing, profilometry, mechanical, tribology, imaging and many other areas has brought its patented technology for measuring yield strength to market which is about to replace the traditional yield strength testing machine totally.

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Nanovea has introduced its patent pending breakthrough method of reliably acquiring yield strength through indentation; ultimately replacing the traditional tensile testing machine for yield strength measurement

For measuring the yield strength of any metal, Nanovea uses a specially developed mechanical tester in indentation mode which has a cylindrical flat tip. This is a little brain applied to the conventional methods similar to measuring elastic limits and different hardness tests. The patented technology will give a reliable value directly based on its cylindrical tip. The technique applied is simple. The principle says, that load per unit surface area of the penetrating indenter is directly linked to the load V/S surface area at which material  starts <em>flowing</em><em> </em>in a tensile mode test. The new method hence promises reliable yield strength results of many materials unthinkable until now.

Traditionally, for measuring yield strength, we have a tensile testing machine. The machine uses a lot of strength to pull materials apart. The resisting forces of any material, until it starts flowing are recorded. The point at which material flows or yields is called yield point and the strength so recorded is called yield strength. However the point is to be verified for not being elastic point, else, the material will simply regain its original form. The yield strength being an important property for biomedical and microelectronics sectors, will find great use and a fast amalgamation in industry for its quick results. The patent by Nanovea will save time of sample preparation and large strength required to pull it apart. This simple and easy technique is expected to be seen as a reliable way of obtaining yield strength same as the earlier <em>Tensile Testing Machine</em>.

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