High temperature storage and temperature cycle TSV Copper sample
do anyone know how to interpret the graph which the y axis = modulus, hardness VS x-axis = displacement into surface . this graph is the result from the nanoindentation test of my High temperature storage (HTS) & Temperature cycle (TC) Through silicon via (TSV) Copper sample. your help is greatly appreciate.
if someone is interested to assist me i will post the graph image into this website.
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